Through the strategic layout of 5G new materials, Holitech enables the rapid development of mobile Internet, industrial Internet, Internet of Things, Internet of Vehicles and other application markets, and is committed to providing one-stop product solutions for 5G high-frequency and high-speed information interaction from materials, structural design, devices and module packaging, to help accelerate the new era of 5G.
High-frequency High-speed Substrates
LCP/MPI Multilayer Flexible Antennas/Feeders
Smart Card Module
High-frequency high-speed substrates include copper foil with adhesive, ceramic-filled PTFE substrates, hydrocarbon ceramic laminates, featuring low dielectric loss, low water absorption, and good processing performance, and can be used in the fields of communication base stations, automotive radar systems, smart phones, smart wear systems, and military industry.
Adhesive layer with low dielectric constant (2.3) and low dielectric loss (0.002)
Excellent adhesion, suitable for LCP, MPI, hydrocarbon substrates, PPO substrate copper cladding
Processing convenience
Excellent heat resistance
High-frequency high-speed substrates include copper foil with adhesive, ceramic-filled PTFE substrates, hydrocarbon ceramic laminates, featuring low dielectric loss, low water absorption, and good processing performance, and can be used in the fields of communication base stations, automotive radar systems, smart phones, smart wear systems, and military industry.
Ceramic filled, without glass fiber cloth or glass fiber cloth effect
Ultra-low dielectric loss Tanδ<0.0015
High ceramic filling ratio, stable dielectric constant
Low Z-axis expansion coefficient, excellent PTH reliability
Low water absorption, good resistance to humidity and heat
Semi-rigid material, with a certain special-shaped fit.
High-frequency high-speed substrates include copper foil with adhesive, ceramic-filled PTFE substrates, hydrocarbon ceramic laminates, featuring low dielectric loss, low water absorption, and good processing performance, and can be used in the fields of communication base stations, automotive radar systems, smart phones, smart wear systems, and military industry.
Processable characteristics compatible with FR4
Excellent high frequency and low dielectric loss
Stable dielectric properties at different frequencies
High TG with excellent heat resistance
Low coefficient of thermal expansion and excellent dimensional stability
